Abstracts: Heat Transfer and Deep Learning with Hongxia Hao and Bing Lv

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May 8, 2025 • 17 mins

Silicon has long borne the burden of heat transfer in electronics, but in a post-Moore’s Law world, researchers like Hongxia Hao and Bing Lv are using AI to discover and design next-generation materials that exceed the limits of silicon’s thermal conductivity.

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.css-14f5ked{margin:0;word-break:break-word;display:-webkit-box;-webkit-box-orient:vertical;box-orient:vertical;-webkit-line-clamp:2;overflow:hidden;}Abstracts: Heat Transfer and Deep Learning with Hongxia Hao and Bing Lv