3D InCites Podcast
As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.
Episodes
We record live at IMAPS to follow a first-time attendee’s leap into advanced packaging and a trio of high school students discovering semiconductors, robotics, and career paths that bridge disciplines. Along the way, we unpack speed-to-market, standards, hybrid vs TCB, and why AI skills matter.
• why a self-funded first conference can reset a career
• key takeaways from PDCs and technical talks
• time...
We sit down with Dr. Subu Iyer of UCLA to unpack chiplets vs dielets, why a universal ecosystem is missing, and how sub‑10 µm bump pitch could make protocols optional. Then we host a panel featuring John Knickerbocker, IBM; Mike Kelly, Amkor; and Tolga Tekin, Fraunhofer IZM on co‑packaged optics, bandwidth, and power for AI data centers.
• chiplet as design construct, dielet as physical die
• lack of univ...
A semiconductor wafer travels around the globe five times on average before becoming the chip in your smartphone. Each journey represents a potential risk to device reliability that few consumers—or even industry professionals—ever consider.
Behind every high-performing semiconductor device lies a carefully orchestrated logistics operation ensuring these sensitive components arrive intact and functioning. As ...
SEMI's flagship event, SEMICON West, is moving to Phoenix, Arizona this October 7-9, 2025, after 35 years in San Francisco, coinciding with the region's semiconductor manufacturing boom and $200 billion in announced investments. In this episode, Françoise speaks with SEMI Americas president, Joe Stockunas, who shares reasons for the move and what attendees can expect to experience. This includes:
•...
The IMAPS International Symposium returns to the Town & Country Resort in San Diego from September 29-October 2, 2024, featuring restructured technical tracks, new Monday panel discussions, and exciting networking events including a special reception aboard the USS Midway aircraft carrier. General Chair Benson Chan and outgoing IMAPS President Erica Folk share what attendees can expect at this premier microelectro...
X-ray technology reveals what the naked eye cannot see - the intricate world of semiconductor interconnects that power our digital lives. In this deep dive with Ben Peecock, Senior Director of Business Development at Nordson Test and Inspection, we uncover the critical differences between x-ray inspection and metrology that keep semiconductor manufacturing on track.
With nearly three decades of experience in ...
Thailand is positioning itself as a new hotspot for semiconductor and microelectronics manufacturing, building on existing infrastructure and establishing key partnerships throughout the region. Managing editor Jillian McNichol shares insights from her recent trip to Thailand where she toured facilities and interviewed industry leaders about the country's ambitious plans.
• Thailand has been involved in ...
The race toward more powerful AI carries a hidden cost that's becoming impossible to ignore: skyrocketing energy consumption. Did you know AI is projected to devour 10% of global electricity by 2030? This staggering figure has even forced tech giants to delay their sustainability goals.
Enter ASE's Executive Vice President Yin Chang, who reveals how the world's largest semiconductor packaging c...
The 75th anniversary celebration of ECTC in Dallas showcases a remarkable evolution in advanced packaging technologies, revealing how semiconductor priorities have dramatically shifted. Rather than the relentless miniaturization of the smartphone era, today's AI-driven applications demand larger packages with more functionality and sophisticated thermal management solutions.
Glass core substrates emerged as the st...
What happens when the world's thirst for artificial intelligence collides with physical limitations? The answer lies at the intersection of silicon innovation and packaging technology.
From the conference hall of ECTC 2025 in Dallas, we're joined by Sam Naffziger of AMD who reveals how AI has transformed from a peripheral topic to the dominant force in computing within just five years. The economic ...
What happens when you gather 75 years of packaging innovation under one roof? The Electronic Component Technology Conference (ECTC) has transformed from a modest gathering of 300 electronics professionals to a powerhouse event attracting over 2,500 industry leaders, researchers, and visionaries. This remarkable journey reflects how advanced packaging has evolved from supporting technology to the driving force behind m...
Pratyush Kamal explains how 3DIC technologies are transforming semiconductor design as Moore's Law slows, requiring closer integration between chip and package design to maximize performance.
• Traditional chip design treated packaging as an afterthought with designers "throwing designs over the wall"
• Economic realities of advanced nodes mean companies now pay more for smaller transistors...
Andrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, discusses the revolutionary advancements in 3D x-ray inspection technology and how they're improving semiconductor manufacturing quality.
• X-ray inspection requires high resolution, speed, and cost-effectiveness to drive better product quality
• Traditional 2D radiographic imaging is being replaced by 3D imaging for more ...
The IEEE MTTS International Microwave Symposium attracts over 9,000 attendees and 500+ exhibitors to share cutting-edge developments in RF, microwave, and advanced packaging technologies. Tim Hancock and Jim Buckwalter from the IMS committee explain why this premier event, taking place in San Francisco's Moscone Center from June 15-20, has become increasingly relevant to professionals in advanced packaging and he...
Acoustic inspection stands as a silent sentinel in semiconductor manufacturing, detecting microscopic defects that could lead to catastrophic failures in high-value applications. Bryan Schackmuth, Senior Product Line Manager at Nordson Test and Inspection, reveals how this technology has evolved from laboratory tools to production-line essentials.
When ultrasound encounters even the tiniest air gap—we're...
The 3D InCites Podcast celebrates microelectronics industry innovation with a special episode featuring this year's award winners in heterogeneous integration and chiplet technology.
• SallyAnn Henry, Jim Straus and David Wang, ACM Research, describe a horizontal rotation plating system for panel-level packaging with superior uniformity across square substrates
• Eric Gongora, of MacDermid Alpha, exp...
Navigating today's complex manufacturing landscape demands unprecedented supply chain resilience. This eye-opening conversation with Barry O'Dowd (Kuehne+Nagel) and Kamal Ahluwalia (Resilinc) reveals why robust supply chains matter more than ever—particularly for semiconductor capital equipment.
The semiconductor industry operates at extraordinary precision, with equipment working at scales as small...
The 3D InCites Member Spotlight episode features exclusive conversations with industry leaders at IMAPS Device Packaging Conference 2025, exploring the cutting-edge of semiconductor packaging innovation and domestic manufacturing expansion.
• Rex Anderson of Micross details their RESHAPE program funding and Integra acquisition, establishing them as North America's largest domestic OSAT
• Calvin Cheun...
Arizona is transforming into the "Silicon Oasis" of America through an unprecedented collaboration that's reshaping semiconductor education from high school through graduate studies. At the heart of this revolution is a groundbreaking partnership between the University of Arizona and Chandler Unified School District, launching the nation's first high school career and technical education program fo...
What happens when AI diagnoses patients better than doctors? Where does artificial intelligence truly stand on the hype cycle? Is all this computational power actually benefiting society? These critical questions frame our fascinating discussion recorded live at IMAPS Device Packaging Conference in Phoenix, Arizona.
Join our expert panel featuring Hemanth Jagannathan (IBM Research), Mark Kuemerle (Marvell), ...
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