The 3D InCites Podcast celebrates microelectronics industry innovation with a special episode featuring this year's award winners in heterogeneous integration and chiplet technology.
• SallyAnn Henry, Jim Straus and David Wang, ACM Research, describe a horizontal rotation plating system for panel-level packaging with superior uniformity across square substrates
• Eric Gongora, of MacDermid Alpha, explains how NovaFab fine-grained copper enables hybrid bonding with customizable annealing times and improved electron migration resistance
• Chuck Woychik, NHanced Semiconductors, talks about how the company brings hybrid bonding capabilities onshore with expertise in wafer processing for both defense and commercial applications
• Keith Felton, Siemens Digital Industries Software, introduces Innovator 3DIC for hierarchical device planning that automatically propagates design changes throughout chiplet interfaces
• Kazuyuki Mitsukura explains how Resonac builds collaborative consortia in Japan and the US to solve complex advanced packaging challenges through shared resources
• Rex Anderson from Micross shares his engineering journey and passion for mentoring the next generation of technologists
• Ron Huemoeller and Eelco Bergman discuss how Saras Micro Devices addresses AI power challenges with embeddable S-Tile capacitors. They also talk about Saras corporate culture.
EV Groups supplies high-volume equipment and process solutions for semiconductor manufacturing.
KLA, SPTS Division
KLA provides semiconductor equipment for metrology, inspection, wafer processing, and more.
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