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April 10, 2025 60 mins

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The 3D InCites Podcast celebrates microelectronics industry innovation with a special episode featuring this year's award winners in heterogeneous integration and chiplet technology.

SallyAnn Henry, Jim Straus and David Wang, ACM Research, describe a horizontal rotation plating system for panel-level packaging with superior uniformity across square substrates
Eric Gongora, of MacDermid Alpha, explains how NovaFab fine-grained copper enables hybrid bonding with customizable annealing times and improved electron migration resistance
Chuck Woychik, NHanced Semiconductors, talks about how the company brings hybrid bonding capabilities onshore with expertise in wafer processing for both defense and commercial applications
Keith Felton, Siemens Digital Industries Software, introduces Innovator 3DIC for hierarchical device planning that automatically propagates design changes throughout chiplet interfaces
Kazuyuki Mitsukura explains how Resonac builds collaborative consortia in Japan and the US to solve complex advanced packaging challenges through shared resources
Rex Anderson from Micross shares his engineering journey and passion for mentoring the next generation of technologists
Ron Huemoeller and Eelco Bergman discuss how Saras Micro Devices addresses AI power challenges with embeddable S-Tile capacitors. They also talk about Saras corporate culture.

EV Group
EV Groups supplies high-volume equipment and process solutions for semiconductor manufacturing.

KLA, SPTS Division
KLA provides semiconductor equipment for metrology, inspection, wafer processing, and more.

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