In this episode, Françoise von Trapp speaks with Chee Ping Lee, of Lam Research, about the critical role of high bandwidth memory (HBM) in generative AI, emphasizing its high bandwidth and compact design.
HBM memory has received a lot of attention as one of the first technologies to implement 2.5D and 3D stacking. Lee explains how HBM uses advanced packaging technologies like TSV and microbumps to achieve high memory capacity and performance. Lam Research's solutions are key to HBM's success.
Listen to learn details about:
- The importance of HBM for AI chip manufacturing
- The relationship between advancedpackaging and HBM
- The differences between different HBM generations
- The future of microbumps and hybrid bonding
- Lam Research’s advanced packaging solutions
Contact Chee Ping Lee on LinkedIN
Learn more about why HBM Is a critical enabler for generative AI in this blog post.
Digital Disruption with Geoff NielsonDiscover how technology is reshaping our lives and livelihoods.
Listen on: Apple Podcasts Spotify
Lam ResearchLam Research equipment and services allow chipmakers to build smaller and better performing devices
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